Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

This article deals with the possibilities of representing the detail of solder ball inner structure more precisely using two methods of sample preparation. The first method of sample preparation is standard metallographic microsection with grinding and polishing with diamond paste with a grain size up to 0.25 μm. The second method is the microsection of the BGA (ball grid array) ball using FIB (focused ion beam) technology. Both technologies contain disadvantages in examining the detail of the solder structure. Scratches are a common problem for grinding and polishing which are caused by the smallest grain in the polishing paste. The FIB technology is designed for a smaller sample rather than a BGA ball. Using this technology, the curtain can be caused by an ion beam. This research is mainly concerned with the comparison of these technologies with emphasis on the possibility of losing information when processing samples.