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Popis
Reflow soldering is nowadays the most used method of connecting electronic components into product.
Soldering itself is done at temperatures between 235°C - 245°C. Effectivnes of heat transfer is a very important
part of the process.This temperature is very high for some components and precise temperature adjustment and
regulation (profiling) is leading part of reliable and effective production process.
Heat transfer coefficient is essential for the whole process, in fact it shows effectivness of the soldering process
from energy transfer point of view. The main influence onto this coefficient has the mechanical construction of
the soldering machine. This article describes some basics of heat transfer theory and processes, needed for
effective soldering process.
Soldering itself is done at temperatures between 235°C - 245°C. Effectivnes of heat transfer is a very important
part of the process.This temperature is very high for some components and precise temperature adjustment and
regulation (profiling) is leading part of reliable and effective production process.
Heat transfer coefficient is essential for the whole process, in fact it shows effectivness of the soldering process
from energy transfer point of view. The main influence onto this coefficient has the mechanical construction of
the soldering machine. This article describes some basics of heat transfer theory and processes, needed for
effective soldering process.
